Packaging

Food Packaging Materials  eBooks & eLearning

Posted by roxul at May 22, 2018
Food Packaging Materials

Luciano Piergiovanni, Sara Limbo, "Food Packaging Materials"
English | 2016 | 84 Pages | ISBN: 3319247301 | EPUB | 1 MB

Vectors - Blank Cosmetics Packaging 24  Graphics

Posted by posterb at May 21, 2018
Vectors - Blank Cosmetics Packaging 24

Vectors - Blank Cosmetics Packaging 24
4 AI | +TIFF Preview | 92 Mb

Vectors - Blank Different Packaging 14  Graphics

Posted by posterb at May 14, 2018
Vectors - Blank Different Packaging 14

Vectors - Blank Different Packaging 14
4 AI | +TIFF Preview | 103 Mb

Composite Materials for Food Packaging  eBooks & eLearning

Posted by roxul at May 8, 2018
Composite Materials for Food Packaging

Giuseppe Crillo and Marek Kozlowsk, "Composite Materials for Food Packaging"
English | ISBN: 1119160200 | 2018 | 462 pages | PDF | 5 MB

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering  eBooks & eLearning

Posted by AvaxGenius at April 27, 2018
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method By Seonho Seok
English | PDF,EPUB | 2018 | 119 Pages | ISBN : 3319778714 | 12.1 MB

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.

Vectors - Blank Cosmetics Packaging 23  Graphics

Posted by posterb at April 24, 2018
Vectors - Blank Cosmetics Packaging 23

Vectors - Blank Cosmetics Packaging 23
4 AI | +TIFF Preview | 102 Mb

Vectors - Blank Food Packaging 3  Graphics

Posted by posterb at April 15, 2018
Vectors - Blank Food Packaging 3

Vectors - Blank Food Packaging 3
3 AI | +TIFF Preview | 53 Mb

Vectors - Blank Cosmetics Packaging 22  Graphics

Posted by posterb at April 11, 2018
Vectors - Blank Cosmetics Packaging 22

Vectors - Blank Cosmetics Packaging 22
4 AI | +TIFF Preview | 131 Mb
Cartons, Crates and Corrugated Board: Handbook of Paper and Wood Packaging Technology, Second Edition

Diana Twede, Susan E. M. Selke, David Shires, "Cartons, Crates and Corrugated Board: Handbook of Paper and Wood Packaging Technology, Second Edition"
English | 2014 | ISBN: 1605951358 | PDF | pages: 585 | 24.8 mb

Fan-Out Wafer-Level Packaging  eBooks & eLearning

Posted by AvaxGenius at April 6, 2018
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging By John H. Lau
English | PDF,EPUB | 2018 | 319 Pages | ISBN : 9811088837 | 43.02 MB

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community.