Ralph Remsburg, Thermal Design Of Electronic Equipment
ISBN: 0849300827 | edition 2000 | multi PDF | 400 pages | 24 mb
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.